New York state will be the recipient of a $4.4 Billion R&D investment to develop new 450 millimeter chip wafer technology, which will be funded by a consortium of five chip makers.   Andrew M. Cuomo, New York’s governor announced the news in a speech.    IBM has taken a leadership position with $3.6 billion invested to fuel the next generation chips that will employ both 14 and 22 nanometer process technology, stated John Kelly, senior VP director of IBM Research.    The company has made investments totaling more than $10 billion in New York since the year 2000.   The consortium was formed to provide the collaboration necessary to make the jump from 300mm to 450 mm semiconductor wafer technology. 

Intel as agreed to build its 450mm headquarters for the east coast in Albany to provide project support.  The company has established plans to build future manufacturing to accommodate 450mm production in the second half of the decade.    Job creation is a big part of this story, with 6,900 positions in upstate New York, which will include 2,500 new technology jobs.  For its part, the only investment the state of New York has committed to as its share of the agreement is a $400 million investment in the State University of New York (SUNY) College for Nanoscale and Science Engineering in Albany which will allocate $100 million towards energy efficiency and low cost energy allowances.

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http://www.computerworld.com/s/article/9220342/IBM_to_lead_4.4_billion_chip_investment_in_New_York